Mems flow sensor

ABSTRACT

A MEMS flow sensor is provided having a micro flow channel etched in a silicon structure composed of two silicon substrates bonded or fused together. A heater and one or more temperature sensors are, in one embodiment, disposed around the perimeter of the flow channel and outside of the channel. In another embodiment, a heater and one or more temperature sensors are respectively disposed outside the flow channel at the top and bottom of the channel. In further embodiments, a heater and one or more temperature sensors are located inside the flow channel on one or more surfaces thereof or around the inside perimeter of the channel. The flow sensors in accordance with the invention are preferably fabricated using wafer scale fabrication techniques.

STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT

N/A

BACKGROUND OF THE INVENTION

Micro-Electro-Mechanical Systems (MEMS) based thermal sensors are known in many different configurations. A basic MEMS flow sensor includes a heater and at least one temperature sensor in the near vicinity to detect heat fluctuation as fluid moves over the heater and temperature sensor(s). The rate of fluid movement over the heater and temperature sensor(s) can be used to determine flow rate.

Existing MEMS flow sensors utilize a heater and temperature sensors on a single plane inside the flow channel on a diaphragm or suspended bridge. One known form of flow sensor is shown in FIG. 1A in which a heater 10 and temperature sensors 12 are supported on a diaphragm or membrane 14 which is disposed in a flow channel 16. Another known version of a flow sensor is shown in FIG. 1B in which a heater 10A and temperature sensors 12A are formed in a silicon plate 18 which is placed in a flow channel 16A. The sensing of temperature in only one plane limits the performance of the device. Thermal convection is omnidirectional and sensing in only a single plane is inefficient.

A raw response curve from thermopiles on a single plane MEMS sensor is typically in the shape of a square root function with sensitivity highest at low flow and gradually decreasing as flow increases. This square root shape reflects the inefficiency of the etched conductors on a single plane.

It would be beneficial to have a thermal flow sensor with improved thermal efficiency, sensitivity and measuring range.

BRIEF SUMMARY OF THE INVENTION

In accordance with the invention a MEMS flow sensor is provided having a micro flow channel etched in a silicon structure composed of two silicon substrates bonded or fused together or a silicon substrate bonded with a glass substrate. At least one heater and one or more temperature sensors are, in one embodiment, disposed around the perimeter of the flow channel and outside of the channel. In another embodiment, a heater and one or more temperature sensors are respectively disposed outside the flow channel at the top and bottom of the channel. In further embodiments, a heater and one or more temperature sensors are located inside the flow channel on one or more surfaces thereof or around the inside perimeter of the channel. The flow sensors in accordance with the invention are preferably fabricated using wafer scale fabrication techniques which per se are known in the art.

The micro flow channel is of a size which improves the sensitivity of the thermal flow sensor since a greater percentage of the measured liquid or gas is heated in comparison with a much larger conventional flow channel in which the heater power remains constant. The micro flow channel also increases the flow impedance to thereby permit much less fluid to flow into the sensor channel. The micro channel is suitable for micro liter per minute or nano liter per minute liquid flow rates.

The MEMS micro flow channel sensors can be used in a bypass to a main flow channel to measure only a portion of the bulk flow. The high flow impedance of the micro flow channel prevents contaminants from entering the bypass channel since momentum to carry particles into the bypass channel is greatly reduced. The use of a micro flow channel in a bypass arrangement is particularly applicable where high sensitivity and contamination immunity is required. Such applications include natural gas metering, mass air flow for internal combustion engines and exhaust gas recirculation for gasoline and diesel engines.

In a preferred embodiment the MEMS flow sensor is integrated in a single chip with associated circuitry. Typically such circuitry includes signal conditioning, amplification, analog to digital conversion, memory storage and digital interface. Wireless transmitter and receiver circuitry can also be integrated into the same chip as the sensor and other circuitry.

Each silicon substrate may include one-half of a flow channel such that when the two substrates are joined or fused together, the completed flow channel is formed. In another embodiment, only one substrate contains the flow channel and the other substrate which could be either glass or silicon provides a cap over the channel. The heater and one or more temperature sensors can be configured inside or outside the flow channel and can be disposed on one or more walls of the flow channel or as loops or coils around the channel. Forming a heater and temperature sensor on more than one plane of the flow channel walls increases the magnitude of the sensor signal since heat is sensed over a larger surface area. The increase in thermal signal leads to higher sensitivity and increases the sensor dynamic range to thereby increase the power efficiency. When the width of the flow channel is larger than the height, temperature sensors and heaters located on the sidewalls are usually unnecessary as the signal gain will be minimal. The wall structures around the flow channel can have etched cavities or thinned walls to reduce heat loss through the silicon material. A thin layer of silicon nitride or other insulating material can be coated over the heater and temperature sensor surfaces to prevent oxidation.

The flow channel has an inlet and an outlet opening which are in fluid coupling relationship with respective fluid ports. The fluid coupling from the inlet and outlet of the flow channel can be direct to respective fluid ports or via intermediate fluid structures.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

The invention will be more fully understood from the following detailed description in conjunction with the drawings, in which:

FIG. 1A is a diagrammatic elevation view of one embodiment of a known fluid flow sensor;

FIG. 1B is a diagrammatic elevation view of another known fluid flow sensor;

FIG. 2A is an exploded pictorial view of one embodiment of a flow sensor in accordance with the invention;

FIG. 2B is a cross-sectional pictorial view of the embodiment of FIG. 2A;

FIG. 3A is a pictorial view of another embodiment of a flow sensor in accordance with the invention;

FIG. 3B is a cross-sectional pictorial view of the embodiment of FIG. 3A;

FIG. 3C is a bottom pictorial view of the embodiment of FIGS. 3A and 3B;

FIG. 3D is a cross-sectional pictorial view of the embodiment of FIGS. 3A-3C;

FIG. 4 is a diagrammatic elevation view of a further embodiment of a flow sensor in accordance with the invention;

FIG. 5 is a block diagram of an integrated chip containing the flow sensor and associated circuitry in accordance with the invention;

FIG. 6A is a pictorial view of a further embodiment of the invention; and

FIG. 6B is a cutaway pictorial view of the embodiment of FIG. 6A.

DETAILED DESCRIPTION OF THE INVENTION

One embodiment of the invention is shown in FIGS. 2A and 2B. A body 20 is formed by silicon substrates or structures 22 and 24 which are bonded or fused together. A flow channel 26 is formed in the body and having at one end an opening 28 formed in substrate 22 and at the opposite end an opening 30 formed in substrate 24. These openings serve as inlet or outlet holes for the fluid which is caused to flow through the flow channel 26. A heater 32 and temperature sensors 34 are etched along the perimeter of the flow channel 26 on each wall thereof to form a complete loop or coil around the inside of the flow channel. Trenches 36 are provided in each substrate 22 and 24 on each side of the flow channel to reduce the thickness of the bulk material of the substrates and thereby reduce heat losses and consequent signal losses. At least one etched opening 38 is provided through the substrates 22 and 24 for the same purpose of providing thinned sidewalls of the flow channel.

Electrical connection is made to the heater 32 and temperature sensors 34 typically by conducting vias through one or more of the walls of the flow channel and corresponding conductive paths provided on one or more of the surfaces of substrates 22 and 24.

Another embodiment is shown in FIGS. 3A-3D in which the heater and temperature sensors are etched around the outside of the flow channel. The flow channel and inlet and outlet holes and structure of substrates 22 and 24 are as shown and described in the embodiment of FIGS. 2A and 2B above. In this other embodiment, the heater 32 and temperature sensors 34 are formed around the exterior surfaces outside of the flow channel.

In an alternative embodiment, the heater and temperature sensors can be etched on each wall outside of the flow channel but not connected to each other. The heaters are energized from a suitable source, and signals from the respective temperature sensors are received by the signal processing circuitry and processed to provide an indication of flow rate. When the width to height aspect ratio of the flow channel is high, heaters and temperature sensors on the shorter sidewalls are not necessary. An arrangement having a heater and temperature sensors on the wider top and bottom walls of a body is shown in FIG. 4. The body in FIG. 4 is similar to that of FIGS. 3A-3D. The heater and sensors on the top and bottom substrates 22 and 24 are separately formed on trenches 36.

In one preferred embodiment, the MEMSIC flow sensor is integrated in a single chip with associated circuitry. A block diagram of the chip 50 is shown in FIG. 5. The chip includes a sensor section containing the flow sensor channel and associated openings in the heater and temperature sensors. The signal processing portion of the chip includes at least one temperature sensor, signal conditioner, analog to digital converter, amplifier, prom memory and wireless transmission and digital communication circuitry.

FIGS. 6A and 6B illustrate an embodiment having a flow channel 60 extending through the body 62 from one side to the other. The heater and temperature sensors may be formed inside or outside the flow channel as described above. The body 62 is bonded to housings 64 and 66 as shown in fluid tight sealed relation. Housing 64 has a chamber 68 a coupled to an opening 70 a. Housing 66 has a chamber 68 b coupled to an opening 70 b. The openings 70 a and 70 b serve as inlet and outlet ports which can be coupled to tubing or fittings by which fluid is supplied to and extracted from the flow channel.

Various alternatives and modifications will occur to those versed in the art without departing from the spirit and true scope of the present invention. Accordingly the invention is not to be limited by what has been particularly shown and described except as defined by the appended claims. 

What is claimed is:
 1. A MEMS flow sensor comprising: a body having a first semiconductor substrate and a second semiconductor or glass substrate bonded together; a micro flow channel etched in the body and having an etched inlet opening at a face of the body and an etched outlet opening at a face of the body; a film heater integral with the body and associated with the flow channel to heat fluid flowing through the channel; at least one film temperature sensor integral with the body and associated with the flow channel in a position spaced along the flow channel from the film heater; at least one film temperature sensor operative to sense the temperature of fluid flowing through the channel; and electronic circuitry integrated in the body and electrically connected to the film heater and at least one film temperature sensor and operative to provide signal representative of the rate of flow of a fluid flowing through the channel.
 2. A flow sensor for gas and liquid comprised of: two semiconductor chips bonded or fused together using wafer level packaging method forming an integrated flow channel with an etched conductor used as a heating source and at least one heat sensing source etched over and or under said flow channel's that; Alternatively could also be comprised of a single semiconductor chip with an etched micro flow channel with said conductors fused onto a glass or ceramic cap that can include thick film or sputtered conductors that can also be used as said heating source and heat sensing source that; Conversely could be comprised of a ceramic or glass structure with an etched flow channel capped via glue or fused to a semiconductor structure with etched conductors forming a heater and temperature sensors and; also includes two etched holes opening for fluid inlet/outlet connecting to said flow channel on each half of the silicon structure and; a second housing portion sealed to at least a portion of the body and having a fluid cavity in fluid communication with the second opening of the fluid flow channel in the body and having a second fluid port;
 3. The flow sensing device of claim 1, wherein conductors forming the heater and at least one temperature sensor are also etched in more than one surface forming a loop around said flow channel or position on top and bottom surface outside said flow channel.
 4. The low sensing device of claim 3, wherein said fluid inlet and outlet etched holes are on the top half of the silicon structure only and; a second housing portion sealed to at least a portion of the body and having a fluid cavity in fluid communication with the second opening of the fluid flow channel in the body and having a second fluid port;
 5. The low sensing device of claim 4, wherein said flow channel do not terminate and continue through the joint structure creating inlet and outlet and; a second housing portion sealed to at least a portion of the body and having a fluid cavity in fluid communication with the second opening of the fluid flow channel in the body and having a second fluid port;
 6. The flow sensing device of claim 3, wherein said conductors are etched on at least one surface of said flow channel forming a sandwich or a loop around said flow channel inside perimeter and; a second housing portion sealed to at least a portion of the body and having a fluid cavity in fluid communication with the second opening of the fluid flow channel in the body and having a second fluid port;
 7. The flow sensing device of claim 1, wherein at least one cavity is etched to thin out bulk material or through bulk material to reduce heat loss from said etched conductor forming a heater via thermal conduction and; a second housing portion sealed to at least a portion of the body and having a fluid cavity in fluid communication with the second opening of the fluid flow channel in the body and having a second fluid port;
 8. The flow sensing device of claim 1 wherein the bonding process is a wafer-scaled process and; a second housing portion sealed to at least a portion of the body and having a fluid cavity in fluid communication with the second opening of the fluid flow channel in the body and having a second fluid port;
 9. The flow sensing device of claim 8 wherein said etched conductors forming a heater and at least one temperature sensor are overlaid with a layer silicon nitride, glass, or other organic material such as polyimide to prevent oxidation when oxygenated gas is the fluid to measure; or prevent a short circuit when electrically conductive liquid is the fluid to measure and; a second housing portion sealed to at least a portion of the body and having a fluid cavity in fluid communication with the second opening of the fluid flow channel in the body and having a second fluid port;
 10. The flow sensing device of claim 8 comprising of integrated electronics including but not limited to signal conditioner, amplification, analog to digital conversion, digital interface and may also include wireless transceiver.
 11. A MEMS flow sensor comprising: a body of semiconductor material having a fluid flow channel etched therein and first and second openings at respective ends of the flow channel in fluid communication with the exterior of the body; the fluid flow channel defined by wall portions of the body; at least one wall portion of the body defining the flow channel having a thickness less than the thickness of the body; a heater and at least one temperature sensor etched on one wall of the flow channel; a heater and at least one temperature sensor etched on another wall of the flow channel; a first housing portion sealed to at least a portion of the body and having a fluid cavity in fluid communication with the first opening of the fluid flow channel in the body and having a first fluid port; and a second housing portion sealed to at least a portion of the body and having a fluid cavity in fluid communication with the second opening of the fluid flow channel in the body and having a second fluid port. 